Define the use cases for LOLIPOP technology demonstrators and specify the corresponding high-level system requirements
Translate the system requirements into designs of the LOLIPOP modules and define the system-level specifications of their individual components
Define the process steps for the integration of the individual components and the packaging of LOLIPOP modules (main and contingency plans) and consolidate these steps into a cohesive process flow
Develop system models for the individual components and modules of LOLIPOP and platforms for the simulation of their system performance
Develop methods and algorithms for the calibration, configuration and operation of LOLIPOP modules
Develop algorithms for the training and operation of the photonic neural networks and model the performance using representative data sets
Design the monolithic structures and subcircuits on the TriPleX platform
Develop the process for the etching of micro-trenches, pockets and recesses on the TriPleX platform
Develop the process for the growth of Ge islands on TriPleX wafers and use it for the heterogeneous integration of Ge-PDs
Prepare the TriPleX wafers and PICs for LOLIPOP modules
Extend the process flow for LNOI wafers with an additional metallization step
Design the LNOI components and spot-size converters for operation at 532, 780, 905, 1064 and 1560 nm, and develop the LNOI wafers/films with the required LNOI subcircuits for LOLIPOP modules
Develop the GaAs active elements at 780, 905 and 1064 nm that will be integrated on the hybrid TriPleX PICs
Develop the integrated circuits (ICs) of the drivers and the TIAs for the modulators and the high-speed Ge-PDs of LOLIPOP modules (3 discrete ICs)
Develop the front-end PCBs of the photonic devices comprising the drivers and the TIAs, and accommodating the routing of the electrical control lines between the PICs and the control electronics
Make thermal simulations and design the packaging solutions for LOLIPOP modules
Deliver the packaged photonic devices for the 7 modules of the project (including the Precursor-4)
Develop the back-end electronics of each module and perform their integration with the respective photonic device
Define the testing methodology for the benchtop tests of LOLIPOP modules
Define the methodology and the demonstration scenarios for the evaluation of LOLIPOP modules in realistic settings
Perform the benchtop tests at the labs of ICCS and CSEM, validate functionalities and find optimum operation settings
Demonstrate the LDV modules and confirm the possibility of Module-2 to extract the vibration profile of SAW elements at 6 GHz
Evaluate the LOLIPOP squeezer (Module-3) and measure squeezing levels of 6 dB
Evaluate the FMCW-LIDAR module (Module-4) in realistic settings with 20 frames per second and demonstrate detection range above 100 m, detection precision of 1 cm and angular resolution 0.2o
Evaluate the photonic neural network with realistic input data and validate its potential for 24 TOPS computation speed
Demonstrate the possibility for functional integration of the LIDAR module with the photonic neural network